The use of insoluble anodes in horizontal conveyorized printed circuit board manufacture: their effect on the performance and electrochemistry of acid copper electroplating solutions
posted on 2018-07-19, 13:53authored byAndrew J. Cobley
The use of insoluble anodes has become critical to the viability of horizontal
electroplating equipment. Despite this there have been few reported studies on the
impact of using such anodes on the electrochemistry of acid copper plating solutions.
A literature search therefore reviewed the different types of insoluble anode that had
been previously utilized in sulphuric acid-based electrolytes and from this a number of
criteria were established that might be applied when selecting an insoluble anode for
horizontal acid copper electroplating.
A 'life study' was then carried out to compare two electroplating baths, one operating
with standard copper anodes, and the other insoluble anodes. [Continues.]
Funding
Shipley Europe Ltd.
History
School
Aeronautical, Automotive, Chemical and Materials Engineering
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
Publication date
2002
Notes
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy at Loughborough University.