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Changqing Liu
Changqing's public data
CONFIDENTIAL FILE
Further enhancement of thermal conductivity through optimal uses of h-BN fillers in polymer-based thermal interface material for power electronics
Han Jiang
2020-04-01T10:32:37Z
Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters
Stuart Robertson
2020-01-28T12:05:17Z
Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose for flexible electrochemical biosensors
Ana M. Rodrigues Rebelo
2019-07-19T12:57:19Z
CONFIDENTIAL FILE
Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging
Jing Wang
2019-07-09T11:07:25Z
CONFIDENTIAL FILE
Carbon nanotube-reinforced poly(4-vinylaniline)/polyaniline bilayer-grafted bacterial cellulose for bioelectronic applications
Ana M. Rodrigues Rebelo
2019-05-20T09:12:03Z
Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding
Wenbo Zhu
2019-04-12T08:02:26Z
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
Zhaoxia Zhou
2019-02-22T09:45:52Z
Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects
Li Liu
2019-01-18T14:08:02Z
Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing
Zhiwen Chen
2019-01-18T13:37:47Z
Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending test
Liping Mo
2019-01-18T13:25:23Z
An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishes
Jing Wang
2018-11-30T14:20:13Z
Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose membranes as bioelectronics interfaces
Ana M. Rodrigues Rebelo
2018-11-30T13:59:49Z
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing
Jing Wang
2018-09-06T13:18:56Z
CONFIDENTIAL FILE
Integration of a microfluidic chip with multiplexed optical fluorescence detector through anisotropic etching of Si using Tetramethylammonium hydroxide (TMAH)
Hannah Robbins
2018-04-17T08:34:07Z
Dehydration of bacterial cellulose and the water content effects on its viscoelastic and electrochemical properties
Ana M. Rodrigues Rebelo
2018-03-19T11:42:58Z
Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient
Guang Chen
2018-02-01T11:18:34Z
Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects
Li Liu
2017-06-22T14:54:08Z
3D multi-nozzle system with dual drives highly potential for 3D complex scaffolds with multi-biomaterials
Zhichao Chen
2017-03-13T12:13:15Z
Fracture behaviour of bacterial cellulose hydrogel: Microstructural effect
Xing Gao
2017-01-26T11:04:38Z
Fabrication and characterisation of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance
Zhichao Chen
2016-10-20T15:12:31Z
Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
Guang Chen
2016-10-20T14:18:42Z
CONFIDENTIAL FILE
Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment
Xiaolong Zhang
2016-08-03T08:24:43Z
Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageing
Guang Chen
2016-07-06T12:37:28Z
Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycle
Guang Chen
2016-07-06T12:27:52Z
Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending
Li Liu
2016-06-24T13:33:29Z
Conductive microfluidic interconnects to enable scalable 3D manufacturing of wearable electronics
Jonny Flowers
2016-06-09T10:20:39Z
CONFIDENTIAL FILE
A scalable engineering approach to improve performance of a miniaturized optical detection system for in vitro point-of-care testing
Hannah Robbins
2016-03-23T10:18:36Z
Through-thickness stress relaxation in bacterial cellulose hydrogel
Xing Gao
2016-02-04T11:52:04Z
CONFIDENTIAL FILE
Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging
Jing Wang
2015-11-16T16:42:56Z
Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnects
Jing Wang
2015-11-16T16:29:12Z
Time-dependent rheological behaviour of bacterial cellulose hydrogel
Xing Gao
2015-11-16T15:21:44Z
Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
Guang Chen
2015-11-16T12:46:27Z
A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etching
Yan Zhang
2015-11-16T11:34:36Z
Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnects
Zhiwen Chen
2015-11-16T11:10:19Z
CONFIDENTIAL FILE
Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal aging
Zhiwen Chen
2015-11-16T10:41:05Z
CONFIDENTIAL FILE
Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder
Guang Chen
2015-08-27T10:35:20Z
CONFIDENTIAL FILE
Novel fabrication of hierarchically porous hydroxyapatite scaffolds with refined porosity and suitable strength
Zhichao Chen
2015-08-27T10:23:29Z
Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition
Liping Mo
2015-08-27T09:17:20Z
CONFIDENTIAL FILE
Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
Junlei Tao
2015-08-07T10:46:35Z
CONFIDENTIAL FILE
Process and performance modelling for individual ACA conductor particles
Junlei Tao
2015-08-07T10:11:49Z
