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Paul Conway
Paul's public data
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Microstructural evolution and protrusion simulations of Cu-TSVs under different loading conditions
Jinxin Liu
2019-10-22T09:19:08Z
Processing-structure-protrusion relationship of 3D Cu TSVs: control at the atomic scale
Jinxin Liu
2019-10-22T08:20:47Z
Supplementary files for 'Comparison of in-sight and handheld navigation devices toward supporting industry 4.0 supply chains: First and last mile deliveries at the human level'
Kate Van-Lopik
2019-09-26T10:34:05Z
Comparison of in-sight and handheld navigation devices toward supporting industry 4.0 supply chains: First and last mile deliveries at the human level
Kate Van-Lopik
2019-08-22T13:31:54Z
CONFIDENTIAL FILE
smaRTI—A cyber-physical intelligent container for industry 4.0 manufacturing
Aaron D. Neal
2019-06-07T09:16:16Z
Protrusion of Cu-TSV under different strain states
Jinxin Liu
2019-05-14T11:52:00Z
Transition zone: a training ethos designed to scaffold a PhD degree
Carmen Torres
2019-04-15T10:37:57Z
CONFIDENTIAL FILE
Magnetic-assisted alignment of reinforcing functionalized-fibers in a composite for lightweight structures
Carmen Torres
2019-03-01T10:54:10Z
CONFIDENTIAL FILE
An industrial evaluation of an Industry 4.0 reference architecture demonstrating the need for the inclusion of security and human components
Richard Sharpe
2019-02-28T13:19:21Z
An automated feature extraction method with application to empirical model development from machining power data
Dimitrios Pantazis
2019-02-22T15:17:24Z
CONFIDENTIAL FILE
3D printing of high performance low temperature sintered ceramic substrates for microwave applications
Darren Cadman
2018-10-19T09:15:15Z
CONFIDENTIAL FILE
Mechanisms of copper protrusion in through-silicon-via structures at the nanoscale
Jinxin Liu
2018-10-18T13:22:53Z
Additive manufacturing of metal-ceramic metamaterials for RF communications
Daniel Engstrom
2018-10-18T09:21:32Z
CONFIDENTIAL FILE
On reproducing the copper extrusion of through-silicon-vias from the atomic scale
Jinxin Liu
2018-02-09T09:31:07Z
An intelligent real-time cyber-physical toolset for energy and process prediction and optimisation in the future industrial internet of things
Sarogini Pease
2017-10-26T08:40:58Z
Hybrid ToF and RSSI real-time semantic tracking with an adaptive industrial internet of things architecture
Sarogini Pease
2017-10-26T08:20:44Z
3D acoustic-structure interaction of ultrasound in fluids for the manufacture of graded materials
J.A. Holt
2017-10-11T08:40:55Z
An atomistic study of copper extrusion in through-silicon-via using phase field crystal models
Zhiheng Huang
2017-10-06T08:25:20Z
A method for quantification of the effects of size and geometry on the microstructure of miniature interconnects
Hua Xiong
2017-10-05T15:56:29Z
Cyber-physical systems in the re-use, refurbishment and recycling of used electrical and electronic equipment
Richard Sharpe
2017-09-22T10:00:44Z
CONFIDENTIAL FILE
Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior
Zhiyong Wu
2017-08-16T11:21:15Z
Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration
Zhiheng Huang
2017-08-16T11:08:28Z
Effects of stress and electromigration on microstructural evolution in microbumps of three-dimensional integrated circuits
Hua Xiong
2017-08-16T10:57:45Z
The effect of pore size and porosity on mechanical properties and biological response of porous titanium scaffolds
Carmen Torres
2017-04-11T10:10:56Z
CONFIDENTIAL FILE
Materials and processing of TSV
Praveen Kumar
2017-02-17T11:23:56Z
CONFIDENTIAL FILE
Microstructural and reliability issues of TSV
Praveen Kumar
2017-02-17T11:18:31Z
Industrie 4.0 implementations in the automotive industry
Diana M. Segura-Velandia
2016-12-09T10:04:21Z
A data management system for identifying the traceability of returnable transit items using radio frequency identification portals
Paul Goodall
2016-12-09T09:59:45Z
Component detection with on-board UHF RFID reader for Industrie 4.0 capable Returnable Transit Items
Aaron Neal
2016-12-08T17:08:24Z
An application of autoregressive hidden Markov models for identifying machine operations
Dimitrios Pantazis
2016-12-08T09:56:05Z
A materials genome approach for heterogeneous integration [Abstract]
Zhiheng Huang
2016-11-07T13:42:04Z
Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides
Shaghayegh Ghanizadeh
2016-10-07T09:46:37Z
Combining business process and failure modelling to increase yield in electronics manufacturing
Diana M. Segura-Velandia
2016-08-01T09:30:02Z
Aerosol-assisted fabrication of tin-doped indium oxide ceramic thin films from nanoparticle suspensions
Nirmal Peiris
2016-05-25T13:16:14Z
Towards industrial internet of things: crankshaft monitoring, traceability and tracking using RFID
Diana M. Segura-Velandia
2016-03-24T17:04:06Z
A wavelet analysis on digital microstructure in microbumps
Zhiheng Huang
2016-03-21T09:54:07Z
Model based automated cycling ergometer
Nandini Chakravorti
2016-02-11T13:32:58Z
CONFIDENTIAL FILE
Distributed monitoring system for material handling
Heinz Lugo
2016-02-11T12:18:49Z
CONFIDENTIAL FILE
Secure document and asset tracking
Heinz Lugo
2016-02-11T12:02:21Z
Sensor-enabled PCBs to aid right first time manufacture through defect prediction
Richard Sharpe
2016-02-04T11:10:15Z
