File(s) under permanent embargo
Reason: This item is currently closed access.
Microstructural and reliability issues of TSV
chapter
posted on 2017-02-17, 11:18 authored by Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul ConwayPaul Conway3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
3D Microelectronic Packaging From Fundamentals to Applications Springer Series in Advanced MicroelectronicsVolume
57Pages
71 - 100 (461)Citation
KUMAR, P. ...et al., 2017. Microstructural and reliability issues of TSV. IN: Li, Y. and Goyal, D. (eds.) 3D Microelectronic Packaging From Fundamentals to Applications, New York: Springer, pp. 71-100.Publisher
© SpringerVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Publication date
2017Notes
This book chapter is in closed access.ISBN
3319445863;9783319445861Publisher version
Book series
Springer Series in Advanced Microelectronics;57Language
- en
