File(s) under permanent embargo
Reason: This item is currently closed access.
Microstructural and reliability issues of TSV
chapterposted on 2017-02-17, 11:18 authored by Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul ConwayPaul Conway
3D microelectronic packaging is the industry trend to meet the ever-increasing market demand for increased performance, lower power, smaller footprint, lower cost, and integration of heterogeneous devices. Chapters 1 and 2 have discussed ...
- Mechanical, Electrical and Manufacturing Engineering
Published in3D Microelectronic Packaging From Fundamentals to Applications Springer Series in Advanced Microelectronics
Pages71 - 100 (461)
CitationKUMAR, P. ...et al., 2017. Microstructural and reliability issues of TSV. IN: Li, Y. and Goyal, D. (eds.) 3D Microelectronic Packaging From Fundamentals to Applications, New York: Springer, pp. 71-100.
- AM (Accepted Manuscript)
Publisher statementThis work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/
NotesThis book chapter is in closed access.
Book seriesSpringer Series in Advanced Microelectronics;57