EMAP2018-CN 07.pdf (1.92 MB)

Protrusion of Cu-TSV under different strain states

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conference contribution
posted on 14.05.2019, 11:52 by Jinxin Liu, Zhiheng Huang, Paul ConwayPaul Conway, Yang Liu
A phase-field-crystal (PFC) model is used to investigate the protrusion of blind TSVs under different strain states. The direction of loading applied to the TSVs has an effect on the protrusion, which is closely related to the copper grains and their orientations at the TSV edges. A nonlinear relation between protrusion and strain rate has been found, which can be explained by different mechanisms of deformation. A higher strain occurring near the top end of the TSVs leads to a larger protrusion of the bind TSVs.

Funding

National Natural Science Foundation of China (NSFC) under grants 51832002, the Guangdong Natural Science Foundation under grant 2015A030312011, and the Zhuhai Key Technology Laboratory of Wide Bandgap Semiconductor Power Electronics under grant 20167612042080001.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Published in

EMAP 2018 EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging

Citation

LIU, J. ... et al, 2019. Protrusion of Cu-TSV under different strain states. Presented at the 2018 20th International Conference on Electronic Materials and Packaging (EMAP), Hong Kong, 17-20 December 2018.

Publisher

© IEEE

Version

AM (Accepted Manuscript)

Acceptance date

04/12/2018

Publication date

2019

Notes

© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

ISBN

9781538656426

Language

en

Location

Singapore

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Keywords

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