Corrosion+characterization+of+Sn-Pb+and+lead+free+solders+in+NaCl+solution-revised+version[1].pdf (44.03 MB)
Download fileCorrosion characterization of tin–lead and lead-free solders in 3.5 wt.% NaCl solution
journal contribution
posted on 2013-10-31, 09:36 authored by Dezhi Li, Paul ConwayPaul Conway, Changqing LiuChangqing LiuThe corrosion resistance of Sn-Pb and several candidate lead free solders were
investigated in 3.5wt.% NaCl solution through potentiodynamic polarisation. Results
showed that in NaCl solution lead free solders had better corrosion resistance than Sn-
Pb solder and the corrosion resistance of lead free solders was similar, but the corrosion
resistance of Sn-Ag solder was better than that of Sn-Ag-Cu and Sn-Cu solders. The
corrosion products for Sn-Pb solder had a two-layered structure with Sn-rich phases at
the outer layer and looser Pb-rich phases at the inner layer. The loose Pb-rich layer was
detrimental to the corrosion property. The corrosion product on the surface of all these
solders was tin oxide chloride hydroxide.
History
School
- Mechanical, Electrical and Manufacturing Engineering