Formation of Ag3Sn plates in SnAgCu solder bumps
journal contribution
posted on 2013-10-31, 09:11 authored by Jicheng Gong, Changqing Liu, Paul ConwayPaul Conway, Vadim SilberschmidtVadim SilberschmidtSpecial experiments are designed to obtain the solid reactants directly from a liquid
solder during phase transformation. Series of such tests performed throughout reflow,
which enables to investigate the entire formation process of intermetallic Ag3Sn plates out
of liquid SnAgCu solder bumps. The results show that Ag3Sn plates are formed first in the
middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is
discussed.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
GONG, J. ... et al, 2010. Formation of Ag3Sn plates in SnAgCu solder bumps. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 527 (10-11), pp.2588-2591.Publisher
© ElsevierVersion
- AM (Accepted Manuscript)
Publication date
2010Notes
This is the author’s version of a work that was accepted for publication in Materials Science and Engineering A. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.msea.2009.12.020ISSN
0921-5093Publisher version
Language
- en
