Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder

Gong, Jicheng; Liu, Changqing; Conway, Paul; Silberschmidt, Vadim

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Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder

journal contribution

posted on 2013-10-31, 09:26 authored by Jicheng Gong, Changqing Liu, Paul ConwayPaul Conway, Vadim SilberschmidtVadim Silberschmidt

The formation behaviour of grains and their components, including Sn dendrites, Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment, capable to obtain the solid reactants directly from the liquid solder during the liquid-to-solid phase transformation. The results show that Cu6Sn5 IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag3Sn IMCs are formed ahead of the β-Sn matrix in the coupling process generating eutectics.

History

School

Mechanical, Electrical and Manufacturing Engineering

Citation

GONG, J. ... et al, 2009. Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder. Scripta Materialia, 61 (7), pp.682-685.

Publisher

Version

AM (Accepted Manuscript)

Publication date

2009

Notes

This is the author’s version of a work that was accepted for publication in Scripta Materialia. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published at: http://dx.doi.org/10.1016/j.scriptamat.2009.05.034