Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder
journal contributionposted on 31.10.2013, 09:26 by Jicheng Gong, Changqing LiuChangqing Liu, Paul ConwayPaul Conway, Vadim SilberschmidtVadim Silberschmidt
The formation behaviour of grains and their components, including Sn dendrites, Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment, capable to obtain the solid reactants directly from the liquid solder during the liquid-to-solid phase transformation. The results show that Cu6Sn5 IMCs are formed first in a grain; then large Sn dendrites; fibre-like Ag3Sn IMCs are formed ahead of the β-Sn matrix in the coupling process generating eutectics.
- Mechanical, Electrical and Manufacturing Engineering