A process model of the infra-red reflow soldering of printed circuit board assemblies
online resource
posted on 2008-11-03, 16:54 authored by David Whalley, Adebayo Oluyinka Ogunjimi, Paul ConwayPaul Conway, David WilliamsThis paper presents the latest results of an evolving model of the
infra-red reflow soldering process. Recent additions to earlier models
are the convective cooling of the PCB as it exits from the furnace
muffle, and the addition of realistic component structures to the PCB
assembly. The paper also presents the initial results from a second
model of a hgh production volume, hgh quality, mass manufacture
oven.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
WHALLEY, D.C. ... et al, 1991. A process model of the infra-red reflow soldering of printed circuit board assemblies. IN: Proceedings of the 11th IEEE International Electronic Manufacturing Technology Symposium, San Francisco, 16-18th September, pp. 122-125. [DOI: 10.1109/IEMT.1991.279761]Publisher
© IEEEPublication date
1991Notes
This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=279761&isnumber=6930 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.Language
- en
