ENG34.pdf (1.1 MB)
Download file

The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications

Download (1.1 MB)
report
posted on 25.01.2013, 09:41 by Baofeng He, Jon PetzingJon Petzing, Paul ConwayPaul Conway, D. Patrick Webb, Richard K. Leach
This report describe research into the role that surface topography plays in influencing the mechanical bond strength of the electroless copper plating of novel glass substrates. The work considers bespoke laser machining of glass substrates, electroless plating chemistry, areal surface topography analysis using non-contact optical techniques, paramaterization of the surfaces using ISO 25178 areal parameters, and scratch testing of plated copper to measure the adhesive bond strength. By correlating bond strength to appropriate areal parameters, it is anticipated that better mechanical adhesive potential of machined glass surfaces can be achieved.

Funding

National Physical Laboratory

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

HE, B. ... et al., 2012. The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. National Physical Laboratory, NPL REPORT ENG 34, January 2012, 25pp.

Publisher

© Queen’s Printer and Controller of HMSO

Version

VoR (Version of Record)

Publication date

2012

Notes

This NPL report is available from the website: http://publications.npl.co.uk/

ISSN

1754-2987

Language

en