The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications
reportposted on 25.01.2013, 09:41 authored by Baofeng He, Jon PetzingJon Petzing, Paul ConwayPaul Conway, D. Patrick Webb, Richard K. Leach
This report describe research into the role that surface topography plays in influencing the mechanical bond strength of the electroless copper plating of novel glass substrates. The work considers bespoke laser machining of glass substrates, electroless plating chemistry, areal surface topography analysis using non-contact optical techniques, paramaterization of the surfaces using ISO 25178 areal parameters, and scratch testing of plated copper to measure the adhesive bond strength. By correlating bond strength to appropriate areal parameters, it is anticipated that better mechanical adhesive potential of machined glass surfaces can be achieved.
National Physical Laboratory
- Mechanical, Electrical and Manufacturing Engineering