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An empirical study of fine-pitch assembly faults and their correction

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thesis
posted on 26.06.2013, 08:15 authored by Kiat Choon Teo
The explosion of SMT and highly-density packages has resulted in more complex and higher density board designs in order to incorporate more features into products while reducing overall package size. This has, in tum, created major challenges for the surface mount manufacturing process, particularly in solder screen printing, component placement, and reflow soldering. Investigation into these areas will contribute to our understanding of the origin of post reflow defects in surface mount assembly and improvement in product quality. The thesis particularly explores empirically the relationship between screen printed paste deposit, the final joint geometry and the fluxing behaviour within the reflowing solder. The thesis also demonstrates the effect of modified screen printing parameters and the lead geometry.

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Publisher

© Teo Kiat Choon

Publication date

1996

Notes

A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.

EThOS Persistent ID

uk.bl.ethos.360832

Language

en

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